See Elnec products at exhibitions:

Electronica India 2010

September 7-10 2010,
BIEC Bangalore, India
hall: Hall 2
stall no.: 2654
exhibitor: Hexaa Bytes Systems


Electronica 2010

November 9-12 2010,
New Munich Trade Fair, Germany
hall: Hall A6
booth no.: Booth 146
exhibitor: Elnec s.r.o.

BGA-Top-239 ZIF

BGA-Top-239 ZIF
(ord.no. 70-1394)

See: Converter manual | Accepted package(s)
Price: $ 495.00 [read this!]
Price 4-7: $ 455.40
Price 8+ : Ask for price [?]
  • top board of BGA converters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operation (mechanical) life of ZIF socket - 10.000 actuations
  • made in Slovakia
Ord. no 70-1394
Socket ZIF BGA144 open top type
Bottom 8+3 rows, 8x25+3x20 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top
Availability in stock 3 [6]
Converter manual
  • For work with BGA device it is necessary put together BGA-Top-239 ZIF with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
  • Once fully actuated, drop the package into the socket from a height of 2 to 3mm above the seating plane.
  • Do not push package while loading or releasing the lid.
  • Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA1.21-1.7
Ball HeightA10.21--
Body ThicknessA2-1.085-
Ball Diameterb0.350.40.45
Body SizeD9.851010.15
Body SizeE9.851010.15
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-12-
NAMESYMBOLMINNOMMAX
ProfileA--1.7
Ball HeightA10.27--
Body ThicknessA2-1.085-
Ball Diameterb0.450.50.55
Body SizeD9.851010.15
Body SizeE9.851010.15
Ball Pitche-0.8-
Ball Array DGD-10-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.7
Ball HeightA10.21--
Body ThicknessA2-1.07-
Ball Diameterb0.350.40.45
Body SizeD9.851010.15
Body SizeE9.851010.15
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-12-
NAMESYMBOLMINNOMMAX
ProfileA1.221.361.5
Ball HeightA10.290.340.39
Body ThicknessA20.931.021.11
Ball Diameterb0.430.480.53
Body SizeD9.851010.15
Body SizeE9.851010.15
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-12-